Welcome to MNIM
2027 International Conference on Micro-Nano and Intelligent Manufacturing
Countdown to the Conference:
About MNIM
With the rapid development of micro‑nano manufacturing technology and the in‑depth integration of intelligent manufacturing concepts, precision manufacturing is advancing comprehensively toward miniaturization, intelligence and integration. Breakthroughs in cutting‑edge technologies such as Micro‑Electro‑Mechanical Systems (MEMS), nano‑fabrication, intelligent sensing and control are reshaping the technological landscape and industrial pattern of modern industry.
The 2027 International Conference on Micro‑Nano and Intelligent Manufacturing (MNIM 2027) will be held in Kaili, China from May 21 to 23, 2027. Centering on core disciplines including mechanical engineering, micro‑nano technology, electronic science and technology, the conference aims to build a communication platform for global experts, scholars, researchers and industrial practitioners to present latest research achievements, discuss frontier scientific issues and promote international academic cooperation.
Scholars at home and abroad are cordially invited to submit papers and participate in the conference for academic exchanges!
Important Dates
Full Paper
Submission Date
March
21
2027
Final Paper
Submission Date
April
21
2027
Registration
Deadline
April
07
2027
Conference
Dates
May
21-23
2027
Topics
The topics of interest for submission include, but are not limited to:
📚︎Micro‑Nano Manufacturing Technology
MEMS/NEMS Design and Fabrication; Nano‑fabrication and Nanometrology; Micro‑Nano Sensors and Actuators; Micro‑Nano Optics and Optoelectronic Devices; Microfluidics and Biochips; Preparation and Characterization of Micro‑Nano Materials
📚︎Intelligent Manufacturing
Industry 4.0 and Digital Twin; Intelligent Control and Optimization Algorithms; Industrial Robots and Automated Production Lines; Industrial Internet of Things and Big Data; Additive Manufacturing (3D Printing); Intelligent Detection and Fault Diagnosis
📚︎Mechanical Engineering
Precision and Ultra‑precision Machining Technology; Mechanical Design and Optimization; Advanced Transmission and Control; Robot Mechanism and Kinematics; Tribology and Surface Engineering; Vibration Analysis and Control
📚︎Electronic Science and Technology
Integrated Circuit Design and Manufacturing; Embedded Systems and SoC; Power Electronics and Micro‑Energy Systems; RF/Microwave Devices and Systems; Flexible Electronics and Wearable Devices; Sensor Networks and Internet of Things
Publication
All accepted full papers will be published in the conference proceedings and will be submitted to EI Compendex / Scopus for indexing.
Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.
Organizer
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